Dimation Inc. ©   2018

An AS9100 Service provider

ITAR Registered.   We take it serious about  being compliant!

Dimation offers Rigid flex printed circuit boards using a combination of flexible and rigid board technologies in an application. Most rigid flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally, depending upon the design of the application. The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.

Rigid flex designs are more challenging than the design of a typical rigid board environment, as these boards are designed in a 3D space, which also offers greater spatial efficiency. By being able to design in three dimensions rigid flex designers can twist, fold and roll the flexible board substrates to achieve their desired shape for the final application's package.

Process Capabilities

•   Panel Size: 18 X 24 max; 12 X 18 min
•   Layer Count: 30 max
•   Hole Diameter: .004 drilled
•   Line Width & Spacing: .002 min
•   Dielectric Thickness Mins:  
•   .001 Kapton, .002 (FR-4)
•   Board Thickness: .125 max
•   Aspect Ratio: 10:1
•   Soldermask Clearance: .003 min
•   1:1 With LDI Mask for Mask Defined Comps
•   UL approved unpierced area: 4"

Materials Availlable

•   DuPont Pyralux:
•   DuPont AP Copper Clad Laminates
•   DuPont LF and FR
•   Coverlays and Bonding Plys

Hitachi:

• Polyimide laminates
• Polyimide no-flow prepreg

Arlon:

• Laminates and no-flow prepregs

Isola:

• Laminates and no-flow prepregs

(STD Turn Times)

(Includes Expedite Fee’s)